| 摘要 |
PURPOSE:To realize an accurate positioning in high yield and to improve productivity, reliability of a product by providing a circular or rectangular window hole at an uppermost layer sheet, and forming a conductor pattern of size including the hole directly under the hole of the uppermost layer sheet. CONSTITUTION:In a multilayer hybrid IC board in which two or more sheets 1-3 are laminated, a circular or rectangular window hole 4 is provided at an uppermost layer sheet 3, and a conductor pattern 5 of size including the hole 4 is formed directly under the hole 4 of the sheet 3. For example, the hole 4 of a square shape having 0.4mm of the length of one side is provided at the third sheet 3 of the uppermost layer, and a silver palladium conductor pattern 5 of a square shape having 0.8mm of the length of one side including the hole 4 is printed at a position corresponding to that directly under the hole 4 on the second sheet 2. A mount land 10 for placing an IC chip and a terminal land 11 for soldering an external connection terminal are provided on the third sheet 3. |
