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发明名称
MOLDING METHOD FOR SEMICONDUCTOR
摘要
申请公布号
JPH0396241(A)
申请公布日期
1991.04.22
申请号
JP19890233321
申请日期
1989.09.08
申请人
SEIKO EPSON CORP
发明人
SAKURAI TOMOO
分类号
H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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