| 摘要 |
<p>PURPOSE:To obtain an ink with excellent heat resistance, electric insulation characteristics, adhesive properties, moisture resistance and chem. resistance, high heat distortion temp. and hardness and little bleeding by compounding a solder resist ink compsn. with a specified epoxy resin. CONSTITUTION:A solder resist ink compsn. count. an epoxy resin (A) of the formula, which can be easily available in the market ant e.g. a commercially available product with an epoxy equivalent of 210 and a softening point of 59 deg.C etc., can be cited. As a curing agent (B), dicyandiamide, imidazole compd., arom. amine compd. and photo-cationic polymn. catalysts are cited. In addition, as a solvent (C), ethyl cellosolve, isopropyl cellosolve. carbitol acetate, etc., are cited. The of components (A)-(C) to be used are pref. 0.5-60 pts.wt. component (B) and 20-60 pts.wt. component (C) based on 100 pts.wt. component (A).</p> |
