发明名称 ELECTROMAGNETIC SHIELDING STRUCTURE OF COMPOUND MATERIAL WITH HIGHLY CONDUCTIVE SURFACE FOR CONDUCTIVE COUPLING
摘要 <p>PURPOSE: To install a reinforcing layer between a barrier tape and a face plate layer by laminating conductive layers such as a non-pored tape, a face plate layer, the barrier tape, a metallic mesh layer so as to assemble, making a composite product integrating the assembly by flowing out resin. CONSTITUTION: A metallic mesh layer 13 is arranged over the upper surfaces of a non-pored tape 7, a face plate layer 9 and a barrier tape 12. After then, in order to sandwitch the layer 13 in cooperation with the tape 7, a face-plate layer 15 the layer 13 is arranged which consists of composite material is arranged on a barrier tape 14 along the outer periphery of the tape 7, and a non-pored tape 17 is additionally arranged. Then the assembly is vacuum-packed and heat-cure processed under a high pressure. After that, the tape 17 is torn off from the composite product. Thereby a clean and highly conductive combining surface is provided securely in the necessary region.</p>
申请公布号 JPH0394498(A) 申请公布日期 1991.04.19
申请号 JP19900135178 申请日期 1990.05.24
申请人 UNITED TECHNOL CORP <UTC> 发明人 CHIYAARUZU EFU RANGU;ROTSUKO AARU DEIJIENOBUA
分类号 B32B43/00;H05K9/00 主分类号 B32B43/00
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