摘要 |
Described is a device, produced using micromechanical techniques, for the measurement of mechanical forces and their dynamic effects. Such devices consist of several elements, such as housing, support structure and sensor, which are bonded or cemented together. Not only stresses caused by differences between the properties of the materials used, but also stresses caused by the way in which the elements are joined together, are transmitted to the sensor and limit the accuracy of the measurement device. The device of the invention is characterized by the fact that the support structure and/or the sensor have weak points to avoid the formation of mechanical stresses. The device is inexpensive to produce and suitable for use in the automobile and household-appliance industries, as well as in industrial measurement instruments.
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申请人 |
FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV, 8000 MUENCHEN, DE |
发明人 |
SANDMAIER, HERMANN, DR.-ING., 8384 SIMBACH, DE;OFFEREINS, HENDERIKUS, DIPL.-ING.;MAYER, GODEHARD, DIPL.-PHYS., 8000 MUENCHEN, DE |