| 摘要 |
PURPOSE:To cut a wafer with high accuracy without wasting a material by correcting a grinding position and the indexing quantity of a columnar body material on the basis of the actually measured thickness data of the wafer after cutting, the displacement data of a cutting blade in the axial direction thereof detected during cutting and the actually measured data of the end surface shape of the columnar body material after the cutting of the wafer. CONSTITUTION:After a columnar body material 18 is moved by predetermined indexing quantity, the columnar body material 18 is moved in a cutting direction with respect to a rotary cutting blade 20 to be cut into a wafer having a predetermined thickness and the end surface of the wafer is ground. The grinding position of a grinding rubstone 2 adjusting the wafer after cutting to a predetermined thickness and the indexing quantity making grinding quantity min. are calculated on the basis of at least one data among the actually measured thickness data of the wafer after cutting, the displacement data of the cutting blade 20 in the axial direction thereof detected during cutting and the actually measured data of the end surface shape of the columna body material after the cutting of the wafer and the columnar body material 18 is moved downwardly corresponding to the indexing quantity and the grinding rubstone 32 is moved to the grinding position to simultaneously perform the cutting and grinding processes of the columnar body material 18. |
