| 摘要 |
PURPOSE: To hold the positions of chips which fluctuates easily at the time of soldering by interposing specific plane structure bodies formed in advance between the chips and substrate. CONSTITUTION: A structure is composed of chips 32 with first soldering balls 36 on their surfaces, a substrate 34 with second soldering balls 38 corresponding to the first soldering balls 36 on its surface and independently and previously formed plane structure bodies 40 interposed between the chips 32 and the substrate 34. Namely, as the structural bodies 40 are interposed between the chips 32 and the substrate 34 of a flip-chip structure 30, a minimum definite gap is formed between the chips 32 and the substrate 34. Thereby, capillary attraction between the chips 32 and the substrate 34 and the aberration of the chips 32 due to it are reduced. |
