发明名称 SLASH MOLDING OF SKIN MATERIAL
摘要 PURPOSE:To prevent lowering of transfer rate because of a soiled mold and enhance filling and transfer properties of a mold skin by forming a film on a molding surface of a mold by means of thermoplastic urethane solution or emulsion and forming a molten layer of thermoplastic vinyl chloride resin powder heat fused with a urethane layer. CONSTITUTION:Thermoplastic urethane solvent or emulsion is applied to a molding surface of a mold and dried, and a urethane layer is formed, and then the temperature is raised and thermoplastic chloride resin powder is filled to form a fused layer and exclusive vinyl chloride resin powder is disposed, while required forced heating from outside is carried out, and a composite layer consisting of thermoplastic urethane layer thus formed and a fused layer of thermoplastic vinyl chloride resin powder is cooled and released from a mold. The thermoplastic urethane should preferably be of 20000 molecular weight or more and its softening point should be in the range of 100-250 deg.C. The average polymerization degree of a soft vinyl chloride resin powder material should preferably be 750-1500. As the mold and the vinyl chloride resin powder are not 1n contact with directly and a stabilizer or the like is prevented to adhere to the mold and a liquid substance is applied to the mold, the transfer properties of the mold is enhanced.
申请公布号 JPH0392314(A) 申请公布日期 1991.04.17
申请号 JP19890230168 申请日期 1989.09.05
申请人 HITACHI CHEM CO LTD 发明人 TEJIMA TERUO;MORI MASATAKA;KAKIGI TADASHI;NOMURA AKIRA
分类号 B29C41/18;B29C41/22;B29K105/04;B29L31/58 主分类号 B29C41/18
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