| 摘要 |
<p>PURPOSE:To enhance high-moisture resistance and high-temperature resistance and improve reliability by using an electronic circuit where a direct film-shaped element is formed on the surface of a sintered porous ceramic body, laminating it, and then impregnating a resin into a pore within a sintered body. CONSTITUTION:Electronic printed circuit boards 1, 1 are laminated above the under a center electronic printed circuit board 2 and these are adhered into one piece. A film-shaped conductive circuit 12 and a film-shaped conductive circuit 13 are adhered and formed onto the surface side of a sintered porous ceramic 11 body 11 as a substrate and the film-shaped conductive circuit 12 is adhered and formed onto the rear side of this electronic circuit board 1. Also, in this adhesion state, the film-shaped conductive circuit 12 and the lower surface of the film-shaped resistor 13 are engaged on a recessed and projected part of the surface among a large number of ceramic particles 10 consisting the sintered porous ceramic body 11 in wedge shape. Also, a resin 14 which is impregnated after lamination is filled into a pore which is formed among the ceramic particles 10 in the sintered porous ceramic body 11. The porous ceramic and film-shaped elements are directly adhered in this manner, thus enabling the film-shaped elements to be extremely stable against environmental change such as temperature and humidity.</p> |
