| 摘要 |
PURPOSE:To obtain secure connection by welding a gold pad to the part to which a gold wire extending from mounted parts is bonded out of a copper pattern, and bonding the gold wire to the gold pad. CONSTITUTION:A gold pad 4 consisting of a gold ribbon, or a gold ribbon whose rear is metallized with nickel to suppress gold-cooper diffusion, or the like is welded by parallel gap welding, etc., to the part, to which a gold wire 3 for connecting with the electrode of mounting parts 1 fixed to a ceramic board is to be bonded, out of a copper pattern 2. After that, the ceramic board is heated with a heater, and the bonding wire 3 is bonded to the electrode of the mounting part of the bonding wire 3, and the other end of the bonding wire 3 is bounded to the gold pad 4. Hereby, even if using a board wherein a copper pattern is used, secure connection can be obtained. |
