| 摘要 |
PURPOSE:To eliminate crack generation by forming a die pad out of a resin board having the thermal expansion coefficient equivalent to that of sealing resin on a resin board consisting of the same resin as the sealing resin. CONSTITUTION:A lead frame 33 is bonded to a resin board 6 through an insulative adhesive or the like, and a semiconductor chip 1 is bonded onto this, and the semiconductor chip 1 and the lead frame 3 are connected by a wire 4, and these are sealed by sealing resin 5. Hereby, the die pad is made of a resin board having the thermal expansion coefficient equivalent to that of sealing resin or a resin board consisting of the same resin as the sealing resin, so the generation of internal stress after resin sealing can be prevented, and cracks, etc., do not occur in the sealing resin, and a one high in reliability can be obtained.
|
