发明名称 MULTILAYER ELECTRONIC CIRCUIT BOARD
摘要 <p>PURPOSE:To obtain a highly moisture-resistant and highly heat-resistant reliable multilayer electronic circuit board by forming film-shaped elements such as conductive circuits, a resistor, and a capacitor directly on the surface of a porous ceramic sintered body and then filling the pores with resin. CONSTITUTION:The lower faces of film-shaped conductive circuits 12 and film- shaped resistor 13 are held in the uneven surfaces and among many ceramic grains 10 forming a porous ceramic sintered body 11. The pores among the ceramic grains 10 of the porous ceramic sintered body 11 remain filled with resin 14. As described above, a multilayer electronic circuit board consists of an electronic circuit board 2 sandwiched between electronic circuit boards 1 through insulating layers 3 and said electronic circuit boards 1 and 2 have film-shaped elements on both faces. Therefore, the boards are strengthened and made hard to break and easy to machine, preventing processing defects such as break and chipping. Gas is prevented from passing and the environment effect is lessened.</p>
申请公布号 JPH0389598(A) 申请公布日期 1991.04.15
申请号 JP19890225951 申请日期 1989.08.31
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
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