| 摘要 |
<p>PURPOSE:To prevent the destruction of an LSI due to external stress by providing an ultrathin LSI which is extremely thinly ground so as to leave an active element part having a bump electrode, an external connection terminal and a resin fixing the ultrathin LSI to an IC module. CONSTITUTION:The IC module 3 fitted in the recessed part 2 of an IC card on the surface side thereof is constituted of an ultrathin LSI 4, a plurality of external connection terminals 5 and a resin 6 fixing the ultrathin LSI 4 to the rears of said terminals and the ultrathin LSI 4 is extremely thinly ground so as to leave an active element part. The thickness of the ultrathin LSI 4 is pref. about 1mum and, when the LSI is thinly ground to this degree, the LSI 4 lowers in strength but is not damaged by stress because bending deformability and recovery properties are provided. A plurality of bump electrodes 7 are formed on the active element part of the ultrathin LSI 4 and respectively connected to the rears of the external connection terminals 5.</p> |
