发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To use a bonding wire having high current conductivity and high reliability for a pad wherein a large current flows by using bonding wires having different current conductivities properly for each pad. CONSTITUTION:Among pads 11, a relatively large current flows in a pad 11a and a relatively small current flows in a pad 11b. Among lead parts 31, a lead part 31a is connected to the pad 11a and a lead part 31b is connected to the pad 11b. A bonding wire 20a which connects the pad 11a and an inner lead 312a of the lead part 31a consists of copper having high current conductivity to withstand a relatively large current. A bonding wire 20b which connects the pad 11b and an inner lead 312b of the lead part 31b consists conventionally of gold.
申请公布号 JPH0385737(A) 申请公布日期 1991.04.10
申请号 JP19890223374 申请日期 1989.08.30
申请人 SHARP CORP 发明人 TOYOSAWA KENJI;WAKAMOTO FUSHINOBU;MAEDA TAKAMICHI
分类号 H01L21/60 主分类号 H01L21/60
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