Positive-acting photoresist composition.

摘要

A positive-acting photoresist composition is described comprising (a) 100 to 5 parts by weight of an AB or ABA block copolymer comprising a high molecular linear segment with a degree of polymerization in the range of 20 to 5,000 as derived from carboxy group (inclusive of anhydride thereof)-free and amino group-free radical polymerizable unsaturated monomors and a high molecular linear segment with a degree of polymerizaiton in the range of 20 to 5,000 as derived from radical polymerizable unsaturated monomers containing at least 40 mole % of a carboxy group (inclusive of anhydride thereof)- or amino group-containing radical polymerizable unsaturated monomer, (b) 0 to 95 parts by weight of an alkali-soluble polyphenol, and (c) 1 to 100 parts by weight of a positive sensitizer. c