| 摘要 |
The disclosure describes a method of manufacturing a structure of a thin, flexible package assembly (10) that permits electrical devices (13, 17) to be bonded to an electrical circuit (12) utilizing mixed bonding techniques. A sacrificial metal carrier material (25) is used to support a thin polyimide or TEFLON substrate (11), through which openings, called "vias", are formed at locations where bonding pad areas are needed to affix electrical devices (13, 17). An electrical circuit (12) is formed on the thin flexible substrate (11), including making the vias conductive, utilizing known processes, and then, the sacrificial metal carrier material (25) is removed, as for example by etching it away, except in locations where metal bumps (21, 22, 23, 24) will be needed to bond a device (17) by thermo compression bonding. |
