| 摘要 |
<p>PURPOSE:To prevent adhesive from squeezing out of a die island by providing a peripheral part of a die island with a wall or a groove for preventing the adhesive to bond the semiconductor chip from squeezing out of the die island when the semiconductor chip is mounted on the die island. CONSTITUTION:A wall 11 is provided at the peripheral part of a die island 1 to prevent adhesive 3 from squeezing out of the die island 1. The wall 11 is formed by applying adhesive thick which is different from the adhesive 3 to bond the semiconductor chip 2, or by bonding a wall-like object which is different from the lead frame body with adhesive, or by pressing mechanically a part excepting the wall part, or by making a wall-like projection remaining at the peripheral part by clearance adjustment of sharing. A groove 12 provided at the peripheral part of the die island 1 to prevent the adhesive 3 from squeezing out of the die island 1 is formed by mechanical pressing or etching of a groove part or by laser light.</p> |
