| 摘要 |
PURPOSE:To restrain the degeneration of a polyimide precursor on a copper conductor wiring and the generation of a residual film at the time of patterning by forming an insulating layer on the copper conductor wiring after subjecting the copper conductor wiring to the surface change in quality which restrains the movement of electrons through the surface. CONSTITUTION:After a copper conductor wiring 2 is formed on a ceramic substrate 1, palladium ions 5 are adsorbed on the surface of the copper conductor wiring 2. For example, the substrate is immersed in a mixed solution of palladium chloride and hydrochloric acid for about 5 minutes. After that, a polymide precursor film 4 is formed on a wiring substrate and patterning is done on the copper conductor wiring 2. At this time, as palladium ions 5 adsorbed on the surface of the copper conductor wiring 2 have an electron catching action, the movement of electrons between the copper and the polyimide precursor is restrained considerably. Accordingly, a remarkable chemical mutual action does not take place and degeneration of the polyimide precursor film 4 on the copper conductor wiring 2 and generation of a residual film at the time of patterning don't occur. |
