| 摘要 |
An improved packaged semiconductor device is provided having an electronic component, such as an integrated circuit, enclosed within a single layer ceramic PGA package. A cap, of substantially the same areal dimension as the base, is sealed to the base forming a cavity in which the integrated circuit is mounted. Input/output pins are attached to through-holes in the base and extend through the base and are exposed by holes in the cap aligned to the through-holes in the base. Extensive glass sealing of the cap to the base, made possible by the substantially co-extensive nature of the cap with respect to the base, provides a sturdy highly reliable seal making the packaged semiconductor device better able to withstand mechanical stress.
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