| 摘要 |
An apparatus for surface mounting an integrated circuit package onto a printed circuit board. Cantilever beams from a housing member extend inwardly toward a central opening and reside upon portion of the lead making contact to the printed circuit board. A tightening of the housing member onto the circuit board by retaining means causes the cantilever beam to provide a downward force to maintain lead contact to the electrical contact, as well as a sideward force for retaining the integrated circuit stationary.
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