| 摘要 |
<p>PURPOSE:To reduce a board manufacturing cost by substantially reducing the number of layers by providing both a power source layer and a ground layer on the same flat surface. CONSTITUTION:A plurality of through holes 2 for through hole connection, a component mounting are formed in a board inner layer 1. A power source line A, a ground line B are disposed substantially straightly in parallel along the holes 2 aligned in one lateral row. The lines A are integrally connected at the left side, and the lines B are integrally connected at the right side.</p> |
