| 摘要 |
PURPOSE:To obtain a prepreg capable of imparting excellent solder heat resistance to laminated boards by impregnating a fibrous substrate with an epoxy resin composition without containing a solvent other than a polymerizable monomer and then carrying out removal of the aforementioned vinyl monomer and conversion of the impregnated substrate into the B-stage. CONSTITUTION:The objective prepreg obtained by impregnating (B) a fibrous substrate with (A) an epoxy resin composition containing (i) an epoxy resin which is a solid at ordinary temperature, (ii) a curing agent (e.g. an acid anhydride-based curing agent), (iii) a polymerizable monomer (e.g. styrene), preferably (iv) a polymerizable unsaturated group-containing resin (e.g. epoxy vinyl ester resin) and (v) a polymerization initiator without containing components other than the component (iii) in a solvent, removing the amount of the component (iii) in the resultant impregnated substrate to <=4 pts.wt. based on 100 pts.wt. component (i) and simultaneously converting the produced substrate into the B-stage. |
