| 摘要 |
A thermal package for electronic components, such as semiconducting chips, is disclosed. Each chip is connected to a pointed circuit interconnect substrate by flexible Tape Automated Bonding leads, and a pliant foam pad is attached to the surface of each chip adjacent the printed circuit interconnect substrate. A heat spreader is attached to the major surface of each chip above the printed circuit interconnect substrate. The heat exchangers are mounted to a support plate that is disposed above the printed circuit interconnect substrate. An external heat exchanger is attached to the exposed major surface of the support plate. The heat spreaders are secured to the support plate so they are urged upwards against the external heat sink. Heat generated by the chips is conducted through the heat spreaders to the external heat sink. Conductors on the support plate and the heat sink are used to provide a voltage to the chips. |
