| 摘要 |
PURPOSE: To obtain a printed circuit board with an improved circuit line profile, without requiring a precious metal shield and an electroless metal bath by adhering a conductive polymer that is soluble and stable in air to a specific region of a substrate and then performing electric plating to the conductive polymer. CONSTITUTION: Polyaniline (emeraldine base) is dissolved into 80% acetic acid and is adhered onto an epoxy substrate, so that it is approximately 1-2μm thick at 100-110 deg.C temperature. The emeralding base is changed to emeraldine salt by this treatment. An epoxy substrate, where polyaniline is coated over an electrolyte solution that contains saturated sulfuric acid copper, is loaded a copper plate is used as an opposite substrate, and electroless copper plating is made, thus obtaining a thin conductive polymer layer 52 that is overlapped on a laminated body 50 at a specific position, such as a circuit conductor and a circuit substrate with a copper layer 54 of a thick electrical plating being overlapped on the polymer layer 52. Pattern electrical plating using the thin film of the conductive polymer can improve an important circuit line profile, when forming a circuit with a thin line.
|
