发明名称 METHOD FOR FORMING ELECTRODE OF ELECTRONIC PART
摘要 <p>PURPOSE:To form an electrode having an ideal gap length on an electrode forming surface under the state of no electrode drooping by providing a bonding agent between the electrode forming surface of the raw substance of an electronic part and a transferred electrode on said surface, and heating the device. CONSTITUTION:A paste-shaped electrode 2 is applied on one surface of a film 4. Then the electrode 2 is dried. A bonding agent 3 is applied so as to cover the dried electrode 2 and dried. A preheated dielectric plate 1 is compression- bonded to a film 4 which is formed of the bonding agnet 3 and the electrode 2 in the laminated state. Thereafter, the dielectric plate 1 in the compression- bonding state is released from the film 4. Then, the electrode 2 is transferred on another electrode forming surface 1a of the dielectric plate 1 by the same way. Thus the electrodes 2 are formed on the electrode forming surfaces 1a on both sides of the dielectric plate 1. Then the dielectric plate 1 is heated. The bonding agent 3 between the electrode 2 and the dielectric plate 1 is contracted in said heating. Thus the electrodes 2 are also contracted. The electrodes are formed on the electrode forming surfaces of the raw substance of the electronic part except for the entire peripheral part.</p>
申请公布号 JPH0383311(A) 申请公布日期 1991.04.09
申请号 JP19890221034 申请日期 1989.08.28
申请人 MURATA MFG CO LTD 发明人 KAKIO GENMEI;ARAKAWA HAJIME;YAMAOKA OSAMU;KUBOTA KAZUYUKI;AZUMA YOSHIMASA;WADA HISASHI
分类号 B32B33/00;B32B43/00;H01G4/012;H01G4/06;H01G4/12;H01G4/33;H01G13/00 主分类号 B32B33/00
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