| 摘要 |
Heat-curable compositions of matter which are stable on storage and which contain (a) 10-70 parts by weight of an epoxy resin having a functionality of at least 3, (b) 90-30 parts by weight of an epoxy resin having a functionality of 2-2.5, (c) a diphenol, the amount of the diphenol being so chosen that 0.6-1.2 hydroxyl equivalents of the diphenol (c) are employed per epoxide equivalent of the epoxy resins (a) and (b), and (d) 10-150 parts by weight, relative to 100 parts by weight of the components (a) to (c), of a thermoplastic having phenolic end groups and having a glass transition temperature of at least 150 DEG C. which is compatible with the mixture of the components (a) to (c), are particularly suitable for the production of prepregs for fiber-reinforced composite materials or for the production of adhesive films. The cured shaped articles obtained therefrom are distinguished by a high heat distortion point and excellent mechanical strength properties.
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