Hydantoin or barbituric acid-extended epoxy resin composition

摘要

A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which have the following formula, <IMAGE> <IMAGE> (b) a mono-nucleus chain extending agent containing N-heterocyclic fatty groups and at least two active hydrogen atoms and represented by the formulas, <IMAGE> and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).