| 摘要 |
A method of making an electronic memory card and, more particularly an electronic module. A metal strip (10) has a plurality of lead-frames (A) formed therein. An insulating strip (50) is fixed to the outside face (10a) of the strip (10) leaving the external tabs (20a to 34a) of the electronic module uncovered. In the following steps, a semiconductor chip is fixed on the inside face of the lead-frame and then the lead-frame (A) is separated from the remainder of the strip (10) by being cut off therefrom.
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