发明名称 METHOD AND DEVICE FOR MANUFACTURING ELECTRONIC PARTS
摘要 PURPOSE:To weld a lead to a terminal by placing a band-shaped lead of an electronic component on the end face of a flat terminal, and irradiating it with laser beam from aslant. CONSTITUTION:A band-shaped lead 4 led out of an electronic component 1 penetrates a seal plate 2 and is placed on a terminal 3 protruding at the rear side, and the surface of this lead 4 is irradiated with laser beam 10 from aslant. Thereby the bead 13 is made uniform in the appearance as crushed, and there is no fear of boring in the lead 4, and bead 13 can be formed in a wider extent. The focus of a condenser lens 5 is moved with motion of a support 7. An optical fiber 6 is directly coupled with this condenser lens 5, and the laser beam 10 is sent irrespective of movement of the lens 5.
申请公布号 JPH0381983(A) 申请公布日期 1991.04.08
申请号 JP19890218308 申请日期 1989.08.24
申请人 NIPPON CHEMICON CORP 发明人 ASHINO KOJI
分类号 H01R43/02;H01G13/00 主分类号 H01R43/02
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