| 摘要 |
<p>PURPOSE:To prevent floating of lead which is caused by warp of a tape and allow its lead to be connected completely to each pad for OLB in the case of performing packaging and facilitate soldering by reflow by bonding an insulating reinforcement member to a frame like suspender which holds a plurality of lead pieces. CONSTITUTION:In a film carreir semiconductor device equipped with a plurality of lead pieces 4b which are joined with bump terminals 7b of a semiconductor chip 2b as well as a frame like suspender 8b which holds a plurality of lead peices 4b, its device is constructed so that an insulating reinforcement member 13b is bonded to the frame like suspender 8b. For example, sprocket holes 1b, a device hole 3b and each lead 4b having one end projecting through a device hole and the other end forming each electro-selecting pab 5b are provided in a film carrier tape 6b. Then, the bump terminals 7b and the leads 4b which are provided on electrode terminals of the semiconductor chip 2b are treated with bonding. Further, a frame like insulating reinforcement member 13b consisting of glass epoxy and the like is bonded to the suspender 8b.</p> |
