| 摘要 |
PURPOSE:To enable a wiring board of this design to be shortened in manufacturing term and decreased in loss due to defects by a method wherein an inner circuit board provided with a power source layer and a ground layer and a wiring layer are separately formed, and then the wiring layer is bonded to one side of the inner circuit board. CONSTITUTION:An inner circuit 2 is formed on an insulating board 1 through an etched foil method to form an inner circuit board C, where the board C is provided with a ground layer, and an adhesive resin layer 4 is formed on the side of a stainless steel plate 8 plated with copper 9. Moreover, an insulated electric wire 5 is wired at prescribed points on the surface of the adhesive resin layer 4 to form a wiring layer D through an NC wiring equipment, and a prepreg 6 is bonded to the surface of the wiring layer D to fix the electric wire 5. By the same method as above, a wiring layer D is formed on both the sides of the stainless plate 8, and the inner circuit board C and the wiring layer D formed on the stainless steel 8 are bonded together in lamination by a guide pin 10 through a pin lamination press method. After a laminating and bonding process is over, the disused plating copper 9 on the stainless plate 8 is removed through etching, and the crosssectional structure of a multi-wire wiring board can be obtained by disassembling the laminated body concerned. |
