| 摘要 |
PURPOSE:To make it possible to secure sufficiently the heat transfer paths from a semiconductor pellet to leads and to reduce the heat resistance of a package by a method wherein an insulating layer is interposingly provided between the pellet and the group of the inner parts of the leads, but a metal layer is formed on the whole surface of the insulating layer. CONSTITUTION:When a pellet 14 generates heat, the generated heat of the pellet 14 is transferred to a metal foil 13, on which the pellet 14 is fixed, and is diffused in the foil 13 as a whole. The heat diffused to a very large area in this foil 13 is dissipated in a resin-sealed package 17 with a very large surface area compared to that of the pellet 14 and at the same time, exceeds an insulating sheet 11 with the foil 13 applied thereon and is transferred to a group of central part inner leads 8B, which are positioned directly under the sheet 11. The heat transferred to the group of central part inner leads 8B is transferred to a group of outer leads 7 formed integrally with the central part inner leads 8B and is dissipated in a wiring board and the atmosphere through the group of outer leads 7.
|
