| 摘要 |
PURPOSE:To prevent misteaching of a bonding point and obtain highly reliable semiconductor device without the possibility of cutting and bending etc., of a fine metal line by causing the shape of an inner extremity to be different from the other inner lead shape at every lead number in a constant spacing. CONSTITUTION:In a semiconductor device having not less than 40 pins, the extremity shape of an inner lead 3 is caused to be different from the other inner lead shape at every lead number in a constant spacing. For example, the inner lead 3 at every lead number in the constant spacing (e.g. pin 1, pin 11, pin 20, pin 31, pin 41, pin 51) is caused to have a unique shape and target inner leads 6 are provided at respective four corners. Thus, misteaching of a bonding point during the bonding process can be eliminated and the problem of reteaching or bonding point dislocation etc., can be avoided. Further, lead recognition can be facilitated and teaching time can be shortened by providing the target inner leads.
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