发明名称 PRINTED-CIRCUIT BOARD FOR MOUNTING ELECTRONIC ELEMENT AND METHOD OF MANUFACTURE THEREOF
摘要 PCT No. PCT/JP84/00565 Sec. 371 Date Jul. 12, 1985 Sec. 102(e) Date Jul. 12, 1985 PCT Filed Nov. 27, 1984 PCT Pub. No. WO85/02515 PCT Pub. Date Jun. 6, 1985.A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board and metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.
申请公布号 SG4191(G) 申请公布日期 1991.04.05
申请号 SG19910000041 申请日期 1991.01.28
申请人 IBIDEN CO, LTD. 发明人
分类号 H05K1/18;H01L23/12;H01L23/13;H01L23/36;H01L23/498;H05K1/02 主分类号 H05K1/18
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