| 摘要 |
<p>PURPOSE:To obtain a multilayer printed-wiring board without haloing which is superb in adhesion property as well as resistance against acid, resistance against alkali, and resistance against heat by performing oxidation treatment of a copper foil surface of a circuit pattern, performing dipping treatment in an organic acid solution of a specific pH with a carboxyl group, and then performing lamination for integration. CONSTITUTION:A circuit pattern is formed at a glass-epoxy copper-clad laminated plate, is washed in water, and is subjected to soft etching by ammonium persulfate. After that, it is washed within sulfuric acid solution, is washed in water, and is treated by an inner layer copper foil oxidation treating agent, thus forming an oxide film on the copper foil surface. After it is washed, it is dipped into a formic acid solution with pH1.5-5. Then, after it is washed in water, it is dried, and an epoxy prepreg is superposed on the upper and lower surfaces of the circuit board for inner layer, thus creating a multilayer printed-wiring board by heating and pressing.</p> |
