| 摘要 |
PURPOSE:To prevent generation of a distortion or peeling and cutting of a bonding wire, by a method wherein the primary and secondary molding cavities are provided on the same mold, a semiproduct obtained by injection-molding a casing on one surface side of a lead frame with the primary molding cavity is charged instantly into the secondary molding cavity and the other surface side is molded. CONSTITUTION:The primary and secondary molding cavities 3a, 3b are formed on confronting surfaces of movable and stationary molds 1, 2 by the same number. A lead frame L is fitted to a recessed part 1a of a movable wall 1 of the primary molding cavity 3a by placing its surface side up, to begin with, the movable mold 1 is clamped and molding is performed. Simultaneously with mold breaking an ejector pin 18 is ejected within a cavity 2a, the semiproduct S' is peeled off from the stationary mold 2, conveyed to a fixed ejecting position along with the movable mold 1 and further removed from the movable mold 1 with an ejector pin 9 by an ejection mechanism P. In this instance, since a resin casing is formed already on the surface, a boning wire is not cut off. Then a part whose molding is complete is fitted in a recessed part 1b of the movable mold 1, fitted to the secondary molding cavity 3b, injection and molding break are performed again and a product is obtained. |
