| 摘要 |
PURPOSE:To improve productivity at the time of forming, decrease the degradation of terminal strength, and improve terminal size accuracy after working and mounting properties, by directly forming a resist coating film for preventing solder flow on the lead frame green material of the part where a plated coating film of a lead terminal is not formed. CONSTITUTION:A lead terminal is soldered and connected with terminal connection electrodes 13 formed on the surface or the rear or both surfaces of an insulative substrate 11. As to a lead frame 12, a resist coating film 15 is directly spread on a lead frame green material which is formed by punching and has not yet been subjected to plating treatment. After that, plating treatment is performed. Said lead frame 12 is inserted into the insulative substrate 11 on which parts have been mounted. By using a jet system soldering machine, the substrate 11 and the lead frame 12 are soldered. At the time of soldering, solder tends to flow out along the lead frame 12 which is used as a lead terminal. The solder, however, is blocked by the resist coating film 15 spread on the lead terminal, so that the lead frame 12 further than the resist coating part is not affected. |
