| 摘要 |
PURPOSE:To enable alignment of a lead to be detected accurately and achieve an inexpensive production by projecting a parallel light flux toward a lead column of electronic component, by receiving the parallel light flux which passes the lead column, and then by comparing the amount of received light at this light-receiving part with a reference amount of received light for judging to see if the lead is aligned. CONSTITUTION:A lead column 13 is transferred to a light path of a parallel light flux 22 which is located at the mid point between a projection light part 20 and a light-receiving part 21 of an inspection device 18 and the parallel light flux 22 is projected from the projection light part 20, which passes through the lead column 13 and is received at the light-receiving part 21. The amount of received light which this light-receiving part 21 receives and reference amount of received light when the previously set lead 13a is aligned are compared for judging the alignment of the lead 13a. Then, only a conforming IC 11 where the lead 13a is aligned is mounted on a substrate. |
