发明名称 MOLDING MATERIAL AND METHOD FOR CLEANING OF DIE
摘要 PURPOSE:To enable cleaning of a die simply and efficiently, by performing molding by making use of a molding material consisting essentially of amino resin, a filling agent and epoxy resin and taking in a deposit on the surface facing on a cavity of the die. CONSTITUTION:A material consisting essentially of amino resin, filling agent and epoxy resin is constituted so that when the material is molded within a die, a deposit on the surface facing on a cavity of the same die is taken in a molded product. Since the amino resin possesses properties, which is apt to take the deposit in the molding material, and moreover a low cost, the same is suitable for cleaning. A combined matter of the same with the rubber becomes apt to take in the deposit on the mold by coupling holding properties of the amino resin with adhesion of the rubber. It is preferable to use an organic filling agent together with an inorganic filling agent as the filling agent. Those materials are made into the molding material by performing mixing, kneading and crushing of them and granulation at need. Molding is performed by putting the molding material into the cavity of the die.
申请公布号 JPH0381111(A) 申请公布日期 1991.04.05
申请号 JP19890218829 申请日期 1989.08.24
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OTA AKIHIRO;IKOMA SUNAO
分类号 C08L61/20;B29C33/72;B29K61/20;B29K63/00;B29K105/16;C08G59/00;C08L63/00 主分类号 C08L61/20
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