| 摘要 |
PURPOSE:To provide a polyimide resin composition, a prepreg thereof and a laminate board thereof having a low dielectric constant, high through-hole reliability and excellent flame retardance by compounding a specific polyimide resin with a specified amount of a triallylisocyanurate, etc. CONSTITUTION:(A) 100 pts.wt. of a polyimide resin prepared by reacting an unsaturated bis-imide with a diamine and containing >=11wt.% of at least one of alkyl groups and alkylene groups excluding methylene group is compounded with (B) 10-200 pts.wt. of a triallylisocyanurate mixture comprising 1 pt.wt. of an isocyanurate polymer having a weight-average mol.wt. of 500-10000 and 0-100 pts.wt. of triallylisocyanurate, (C) an curing accelerator, (D) a diluent, etc., and, if necessary, further a brominated resin having reactive groups containing bromine in an amount of 1-50 pts.wt. per 100 pts.wt. of the polyimide. The composition is impregnated into a substrate and semi-cured to prepare a prepreg, which is laminated. |
