| 摘要 |
PURPOSE:To enable an IC chip up to a size of die pad to be die-bonded and reduce arc of a wire when performing wiring by forming a wiring lead part to be in slanted structure. CONSTITUTION:A wiring lead part 3 for wiring around a die pad is formed in a slanted surface. In the die-bonding process, an IC chip 4 is gripped by a forceps 6 of die-bonding and slanted surface structure of the wiring lead part 3 allows a die bonding of the IC chip 4 of a size corresponding to a die pad 2. Also, it is possible to make the arc of a wire 5 of wiring to be less than a required length, thus reducing restrictions of die pad of ceramic package for the size of IC chip. |
