| 摘要 |
PURPOSE:To improve the mounting density of semiconductor elements where a thick film substrate is mounted on a printed board by laying out at least two lead frames in parallel and sealing them with resin. CONSTITUTION:At least two lead frames mounted with semiconductor elements in the same package are laid out in parallel with the mounted side. The two lead frames 1 are coated with an adhesive 3 in each die bonding section 1b and semiconductor elements are positioned and tentatively fixed, then heat cures at a high temperature and fixed. A gold line 4 is connected with an interconnection pad 2a formed on the surface of semiconductor element 2 based on a heat pressure bonding process. Then, the other end of the gold line 4 is connected with an outside lead 1b. The two lead frames 2 which have finished the above process are assembled and resin-sealed based on the transfer mold process and finished by further bending the outside lead 1b. This construction makes it possible to improve the mounting density per unit area of a thick film substrate or a printed board.
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