| 摘要 |
<p>The bond strength of a sintered hard alloy substrate surface is increased by (1) polishing the same electrolytically with a pulse voltage, or further subjecting the resultant substrate surface to electrolytic polishing and thereafter a scratching treatment with abrasive grain, or (2) polishing the substrate surface electrolytically with a steady-state voltage, and further subjecting the resultant substrate surface to electrolytic polishing and thereafter a scratching treatment with abrasive grain. Film type dense diamond having a high bond strength is then deposited on this substrate by a vapor deposition method.</p> |
