| 摘要 |
<p>PURPOSE:To prevent pieces and powder of photoresist from scattering and attaching to a pattern during process so as to prevent failures by a method wherein an entire peripheral surface except a part where an original pattern of a positive photoresist applied on the surface of a wafer substrate is separately exposed in the case of stepper exposure method. CONSTITUTION:In the case of stepper exposure method, an entire peripheral surface except a part where an original pattern of positive photoresist applied on the surface of a wafer substrate 1 is separately exposed. That is, with respect to a peripheral part except a shaded part in the figure, exposure is done as per parts corresponding to chip regions through an original pattern whose entire surface comprises a transparent part. Therefore, peripheral photoresist 3 in which no pattern is written is all removed so that such a problem that the photoresist touches other objects during process to be peeled off like powder or pieces seldom occurs. Thus scattering of resist pieces and powder and attaching to the pattern is prevented thereby eliminating failures and improving yield.</p> |
