| 摘要 |
PURPOSE:To prevent defective soldering by preheating material to be joined on a conveyor up to the specified temperature, regulating the temperature difference generated by size of a packaging component, etc., and heating quickly the material to be joined whose temperature difference is regulated above the melting point of solder to carry out soldering. CONSTITUTION:The packaging component 9 is mounted on cream solder 11 on a substrate 8 to form the material 10 to be joined. When the material 10 to be joined is mounted on the conveyor 7 and put in a preheating part 3 of a furnace main body 1, it is heated by stages in order from the ordinary temperature to 160 deg.C and sent to a temperature difference regulation part 4 where the temperature difference among the packaging components 9 generated on the preheating part 3 is regulated by an air blasting means. When the material 10 to be joined is then proceeded in a reflow part 5, the material 10 to be joined is irradiated with a halogen lamp and heated to the specified temperature and the solder 11 is molten and the packaging component 9 is joined to the substrate 8 which is then put in a cooling part 6 and cooled rapidly by fans 18. By this method, even the substrate on which an Al electrolytic capacitor, etc., which are components having low heat resistance are packaged mixedly can be prevented from defective soldering. |
