| 摘要 |
<p>PURPOSE:To reduce the design man hours of a multilayer wiring board, and to decrease the number of printing masks to be prepared, and besides to facilitate the manufacturing by stacking power source matching layers collectively on the parts mounting side. CONSTITUTION:A multilayer wiring board 4 is composed of an enlarged layer 7, a power source matching layer 8, a signal layer 9, a power source layer 10, and through holes 11, 12, 13 and 14 for connection. The power source matching layer 8 is provided according to the voltage of semiconductor chips 1-3 mounted, and if three kinds of voltages are required concerning the semiconductor chips 1-3, those for three layers are provided. Accordingly, the power source matching layer 8, in case of developing the one wherein semiconductor parts to be mounted and different or the one where layout is different, is designed correspondingly. For the power source layer 10 on the side lower than the power source matching layer 8, even if different kinds of semiconductor chips are mounted in different positions, common pattern can be created.</p> |
