| 摘要 |
PURPOSE:To improve productivity, reliability and to reduce an apparatus in size and thickness by electrically connecting a resin-sealed semiconductor chip to a lead frame through an adhered part provided at the end of an inner lead of the frame. CONSTITUTION:A connecting bump 12 is formed on a chip formed to be transferred to the end of a tapelike lead frame at the end of an inner lead of a lead frame 11 made of Cu or the like by Au plating or the like. After the bump 12 is aligned with the electrode pad of a semiconductor chip 13, it is adhered by thermocompression bonding. The bump 12 is formed of a plating layer 15 made of Ni, Cu, etc., and a second plating layer 16 made of Au, Pt, etc., formed on the layer 15. The end of the frame 11 is bent in a wing state, and upper and lower molding ratio is easily aligned on the lead in the case of sealing with resin. The warpage of a package can be suppressed, and the end of the frame 11 is bent in a wing state 12 to the side of the chip 13 to effectively prevent it from touching the edge. |
