| 摘要 |
<p>A low-melting point glass sealed semiconductor device comprises a pair of ceramic substrates (1, 2), each of which is shaped like an arch. The ceramic substrates (1, 2) are overlaid with each other, in such a manner as to define a space (8) between them. Through this space (8), a gas generated from a thermosetting mounting agent (9) used for adhesion is guided to the outside of the semiconductor device.</p> |
