发明名称 |
PACKAGE MADE FROM LIQUID POLYMER COMPOSITION |
摘要 |
PURPOSE: To obtain a package having an optimal mechanical characteristics in which the possibility of damaging a wire on a carrier is minimized at the time of molding the package by imparting a liquid crystal polymer in a polymer composition with a specified pressure-flow index. CONSTITUTION: The package has an opening for containing an integrated circuit composed of an encapsulating element imparted to a carrier (lead frame) which can be sealed by means of a sealer. The encapsulating element is imparted to a preliminarily formed metal strip serving as a carrier. The metal strip has thickness of several mm to the maximum and made of copper or an iron/ nickel alloy and has higher temperature resistance. Polymer in a polymer composition preferably comprises a unit having oxybenzoyl and biphenoxy and it is produced from terephthalic acid and/or isophthalic acid. That polymer has mean pressure-flow index (PFI) value of maximum 8.5g/10min. The PFI value is a measure of workability and measured under a constant pressure using a rheometer. |
申请公布号 |
JPH0376146(A) |
申请公布日期 |
1991.04.02 |
申请号 |
JP19900148817 |
申请日期 |
1990.06.08 |
申请人 |
STAMICARBON BV |
发明人 |
FUBERUTASU MARII KURETSUSENZU;FUREDERITSUKU ERUNSUTO NITSUKUSU;YOHANESU ARUBERUTO YOSEFUSU MARIA KINGUMA |
分类号 |
H01L23/08;C08G69/44;H01L23/10;H01L23/29 |
主分类号 |
H01L23/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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