| 摘要 |
<p>PURPOSE:To contrive highly accurate wire bonding by carrying out pattern recognition at the position of one recognition height among more than two recognition heights in the same work and, after allowing the height of the work to move to the height at a position of the other recognition object, by performing pattern recognition at the position of the above other recognition object, thereby performing the correction of position shift which is required for wiring connection. CONSTITUTION:Pattern recognition of the inner lead 1a of a lead frame 1 is carried out by picture processing through a camera 10 for monitoring. Then, this device lowers the inner lead 1 at an amount corresponding to a stepped difference between the inner lead 1 and a semiconductor chip 2, that is, until the focus of an optical body tube 11 comes to a position where the bonding pad of the semiconductor chip 2 is in focus. Under such a state, pattern recognition in the bonding pad of the semiconductor chip 2 is carried out by picture processing of the camera 10 for monitoring. Then, position correction of respective wire bonding co-ordinates is performed by the amount shifted from the initialization co-ordinates of the inner lead 1 and the semiconductor chip 2 which are obtained by pattern recognition and wire bonding is carried out by a bonding tool 14 while leaving a block 7 holding the work to stop as it is at the 2nd stopping position.</p> |
